| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the adhesive strength and reduce the incidence of trouble due to the peeling of covers by grinding a first and a second joining face arranged opposite to each other on a rising part formed on each of the covers, or obliquely butting the joining faces, to join both covers in such a manner that a storage part is formed internally. SOLUTION: When manufacturing an IC card, electronic parts 2 are mounted on a substrate to form a circuit module 3 and this circuit module 3 is split into individual modules 3. Next, the modules 3 are mounted on a storage part 15 surrounded by a first rising part 11 formed on a first cover 10 of a thermoplastic resin. At the same time, a coil 5 for sending/receiving data is soldered in a well part 16 provided outside the rising part 11, after soldering a cell 4 to the storage part 15. After that, an adhesive 6 is packet into the storage part 15, and the second rising part 21 of a second cover 20 and the first rising part 11 are arranged in such a manner that both parts 11, 21 are ground to each other, and are pressed. Finally, the adhesive 6 is thermally cured in a constant temperature layer to bond both covers 10, 20 together.</p> |
