发明名称 HEAT-RAY-SHIELDING RESIN COMPOSITION AND COATING FILM
摘要 PROBLEM TO BE SOLVED: To obtain a heat-ray-shielding composition having a good transparency by mixing inorganic metal microparticles having infrared-absorbing capacity with an anthraquinone compound and a (meth)acrylate and to obtain a heat-ray- shielding film excellent in processability and weathering resistance by applying this composition to a substrate. SOLUTION: This composition is obtained by mixing 20-70wt.% inorganic microparticles (A) having infrared-absorbing capacity and a particle diameter of primary particles of 0.5μm or below with 0.1-30wt.% anthraquinone compound (B) represented by the formula (wherein R is H or p-tolyl) and having a maximum absorption wavelength of 650nm or longer and 10-98wt.% (meth)acrylate (C) having at least one (meth)acryloyl group in the molecule and being polymerizable with an actinic radiation such as ultraviolet rays or electron beams. This composition may optionally contain 2-50wt.% resin component such as an acrylic resin, a polyester resin or a butyral resin. It is applied to a substrate to obtain a heat-ray-shielding film.
申请公布号 JPH09316115(A) 申请公布日期 1997.12.09
申请号 JP19960159276 申请日期 1996.05.31
申请人 NIPPON KAYAKU CO LTD 发明人 KANEKO KATSUICHI;IZUMI KAORU;SAKURAI HIROSHI
分类号 C08J7/06;C08F2/44;C08F2/50;C08F20/10;C08J7/04;C09D4/00;C09D4/02;(IPC1-7):C08F2/50 主分类号 C08J7/06
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