| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition for semiconductor sealing which enables a semiconductor device to be highly reliable with respect to flame resistance and high-temp. storability, by compounding a specific epoxy compound, a specific phenolic resin, a specific antimony pentaoxide composition, a specific halogenated epoxy resin, an inorganic filler, and a curing accelerator. SOLUTION: The composition comprises as essential components: (A) an epoxy compound having two or more epoxy groups per molecule; (B) a phenolic resin having two or more hydroxyl groups per molecule; (C) an antimony pentaoxide composition which is obtained by adding aluminum sulfate to an aqueous antimony pentaoxide sol in an amount of 0.5-30wt.% in terms of Al2 O3 based on antimony pentaoxide to generate an aluminum hydroxide gel at a pH of 5=9, and subjecting the resultant mixture to filtration, washing with water, drying, and pulverization, and which has an average particle diameter of 0.01-0.5μm; (D) a halogenated epoxy resin having two or more epoxy groups per molecule; (E) an inorganic filler; and (F) a curing accelerator.
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