| 摘要 |
PROBLEM TO BE SOLVED: To realize downsizing and thinning of a package, and simple attachment of the package to another device by changing a conventional package design of an IGBT(Integrated Gate Bipolar Transistor) or the like. SOLUTION: A book-type resin package 1 comprises a flat case where a power semiconductor device and its peripheral control circuits are integrated. A radiation fin 5 which functions as a heat sink for the power semiconductor device is integrally attached to the bottom surface of the resin package 1. Further, plug-shaped input-output main terminals 14 and control terminals 16 led from the control circuits are provided on one side surface of the package 1. The package is installed in another device by plug-in connecting a connector of the device with the main terminals and the control terminals. |
