| 摘要 |
PROBLEM TO BE SOLVED: To simplify a process and improve dimensional precision, by vacuum- sucking metal for a bump through a wire insertion hole of a bonding tool, sucking and fixing the metal to the tip of the bonding tool, and bonding the metal to a wiring pad. SOLUTION: A metal ball 4 is sucked and fixed to the tip of a bonding tool 3 by vacuum-sucking the ball through a wire insertion hole. The bonding tool 3 which sucks the metal ball 4 is moved just above a wiring pad 2 on a semiconductor element 1, and alignment is performed. While heat or ultrasonic wave is used or heat and ultrasonic wave are jointly used, the bonding tool 3 is made to descend, the metal ball 4 is fixed by pressure or fused and bonded to the wiring pad, and a bump 5 is obtained. Thereby a process is simplified and the bump 5 excellent in dimensional precision can be formed. |
