发明名称 RESIN MOLDING AND METHOD FOR DECOMPOSING AND SCRAPPING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin molding which can be easily degraded in soil after use and to provide a method for decomposing and scrapping the resin molding. SOLUTION: This resin molding is prepared from a resin compsn. comprising a thermoplastic resin, a photocatalytic material, and a saccharide or a salt of an org. carboxylic acid. The method for decomposing and scrapping the resin molding comprises treating the resin molding in a first treatment chamber where ultraviolet light is applied to the resin molding and then decomposing the resin molding in a second treatment chamber containing a microorganism. Since the resin molding contains a photocatalytic material, the ultraviolet radiation causes the surface of the resin molding to be oxidatively decomposed with ease, so that subsequent biodegradation is rapid. Further, the presence of the saccharide or the salt of an organic carboxylic acid can accelerate the biodegradation.</p>
申请公布号 JPH09309959(A) 申请公布日期 1997.12.02
申请号 JP19960128868 申请日期 1996.05.24
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAKO TOSHIJI;NAKAGAWA NAOHARU;MIZOBUCHI MANABU
分类号 C08J5/10;B01J21/06;B01J35/02;C08J11/06;C08L101/16;(IPC1-7):C08J5/10 主分类号 C08J5/10
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