| 摘要 |
<p>PROBLEM TO BE SOLVED: To detect defective junction such as peeling of the pad of a semiconductor device whose difference does not appear in the quantity of penetration of X ray, or a junction trouble such as a pad cracks, etc. SOLUTION: The inspection is carried out of the following steps; illumination having wavelength in the band of infrared ray wavelength is applied (4) from right above the opposite side to the junction of a semiconductor device, and an image is taken in with a camera (1) which is attached coaxially with the illumination and has sensitivity in the band of infrared ray wave length. The infrared ray wavelength penetrates the silicon layer of the semiconductor device of flip chip mounting, and is reflected at the aluminum pad face, so the camera can take in the image of the aluminum pad face. In the case that there is a damage in the pad of the semiconductor device, it becomes a different image from a normal pad, so the faulty place can be found out visually by indicating the image taken in from the camera on a monitor (5). Moreover, the damage on the pad can be automatically detected by processing and computing the image taken in from the camera, so that the difference may come out in the measured value between a normal pad and a faulty pad.</p> |
