| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board having excellent heat resisting property, moisture resisting property and close adhering property without using a halogen as a nonflammable method and without generation of hydrogen bromide which is poisonous gas, when a burning operation is conducted. SOLUTION: The manufacturing method of a multilayer wiring board using a built-up method contains a process in which a photosensitive resin composition is formed as a layer insulating film at least on one surface of an inner layer board where a red phosphorus containing epoxy resin composition is used, and a process in which a conductive layer is formed on a layer insulating film by non-electrolytic plating and electric plating and then a wiring pattern is formed by etching a conductive layer. |
