| 摘要 |
PROBLEM TO BE SOLVED: To improve the bonding strength of a nonwoven base material to a resin and improve the reliability of a printed circuit board, in the printed circuit board using as its base material a nonwoven fabric made of a totally aromatic polyamide fiber. SOLUTION: By using respectively a totally aromatic polyamide fiber and a polyamic acid resin as a main component and a binder, or processing a nonwoven fabric made of a totally aromatic plyamide fiber by dipping it into s polyamic acid resin solution, a base material is obtained by drying. Then, by impregnating the base material with a resin varnish and drying it thereafter, on an obtained prepreg a copper foil is laminated and they are integrated with each other by heating and pressing to obtain a desired printed circuit board. As the resin varnish, the mixed resin varnish of an epoxyresin with a polyamic acid resin may be used allowably. Also, processing a nonwoven fabric made of a totally aromatic polyamide fiber by dipping it into an aprotic solvent, a base material is obtained by drying, or processing further the foregoing base material by dipping it into a polyamic acid resin solution, a nonwoven base material is obtained by drying. Then, by impregnating the base material with a resin varnish and drying it thereafter, on an obtained prepreg a copper foil may be laminated and they may be integrated allowably with each other to obtain the desired printed circuit board. |
