| 发明名称 |
CHEMICAL-MECHANICAL POLISHING OF THIN MATERIALS USING A PULSE POLISHING TECHNIQUE |
| 摘要 |
<p>Uniform chemical-mechanical planarization is achieved at a high material removal rate by pulsing the pressure applied to the wafer undergoing planarization between an initial optimum pressure and a reduced second pressure, preferably about 0 psi.</p> |
| 申请公布号 |
EP0808230(A1) |
申请公布日期 |
1997.11.26 |
| 申请号 |
EP19960902098 |
申请日期 |
1996.01.11 |
| 申请人 |
ADVANCED MICRO DEVICES INC. |
发明人 |
SALUGSUGAN, ISIDORE |
| 分类号 |
B24B37/04;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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