Polymeric compositions with high self-adhesion and packaging materials and packages made therefrom

摘要

The invention relates to a polymeric composition which acts as an improved cold seal mechanism over prior art cold seal structures. The composition comprises a blend of 40% to 80% by weight of a tacky adhesive and 60% to 20% by weight of a lower viscosity, non-tacky resin. The composition has a seal strength of at least 0.2 lbs per inch when sealed to itself at a temperature of less than 120 DEG F., and can be formed into a film for subsequent use in packaging.