Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer

摘要

A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact. The socket applies an evenly distributed force to connect the aligned flip chip die or ball grid array device solder ball pattern to the underlying printed circuit board solder deposit pattern through dendrite penetration of the solder using an interposer situated between and aligned to each such solder pattern.