A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.
申请公布号
US5690890(A)
申请公布日期
1997.11.25
申请号
US19940334236
申请日期
1994.11.04
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;KABUSHIKI KAISHA NIHON GENMA
