| 摘要 |
A method for fabrication of a probe structure comprising a circuit substrate comprising a circuit pattern formed on one side or inside of an insulating substrate and a positioning member formed on either side of said insulating substrate, said positioning member being capable of positioning and retaining a test target at a testing position of the probe structure, and the circuit pattern and the positioning member being in a positional relationship which establishes a continuity between the circuit pattern and a bump contact, which method comprises determining, on the same side of the substrate on which the positioning member has been formed, the position of the bump contact according to the position of the positioning member as a reference position, and forming the bump contact capable of establishing continuity with the circuit pattern. According to the method of the present invention, a probe structure can be obtained which is capable of positioning bump contacts and test target highly accurately as compared to conventional methods. In addition, since conventional production method can be applied to the manufacture of positioning member and bump contacts, highly precise products can be produced economically. The circuit substrate of the present invention which comprises a positioning member can be beneficially used for the production of the probe structure of the present invention.
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