发明名称 WAFER ALIGNING METHOD
摘要 A wafer aligning method for wafer inspection devices, etc., a pre-alignment and a fine alignment are performed by using the same camera, so that pre-alignment and fine alignment can be performed by using the same device.
申请公布号 WO9743785(A1) 申请公布日期 1997.11.20
申请号 WO1997JP01590 申请日期 1997.05.12
申请人 KOMATSU LTD.;MATSUNO, KIYONORI;OKAMOTO, TAKESHI;TADA, SHIGEYUKI;TANUKI, TOMIKAZU;TANAKA, MASAYA 发明人 MATSUNO, KIYONORI;OKAMOTO, TAKESHI;TADA, SHIGEYUKI;TANUKI, TOMIKAZU;TANAKA, MASAYA
分类号 G01N21/88;G01N21/956;G03F7/20;G06T1/00;G06T7/60;H01L21/027;H01L21/66;H01L21/68;(IPC1-7):H01L21/68 主分类号 G01N21/88
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