| 摘要 |
A plurality of conductive lines are formed on a lower base plate. One surface of the lower base plate is divided into a first portion which is to be formed into a lower substrate, and a second portion. The first portion includes a first area which is to be covered with an upper substrate, and a second area. The conductive lines are extended from the first area of the first portion to the second portion through the second area of the first portion. A connecting pattern is formed on the second portion, and is connected to each of the conductive lines. Thereafter, an orientation film is formed on the first area of the first portion. Then, the surface of an orientation film is rubbed in an orientation process. During the orientation process, electric charges which are generated in each of the conductive lines by friction, flow to the connecting pattern immediately. Therefore, the conductive lines and the orientation film are protected from the electric charges, and damage is avoided.
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