| 摘要 |
PROBLEM TO BE SOLVED: To form solder bumps which facilitate flip chip bonding with a high reliability. SOLUTION: Al electrode pads and a surface protective film are formed on a semiconductor substrate. Further, a photoresist layer is formed and patterned so as to have openings on the Al electrode pads. A barrier metal layer is formed over the whole surface of the substrate and, further, the resist layer and the parts of the barrier metal layer on the resist layer are removed by a lift-off method to form solder bump foundation layers. Further, in a remnants removing process, adhesive tape is stuck to the surface of a substrate and then removed to remove the remnants of the resist film and the remnants of the unnecessary parts of the barrier metal layer other than the solder bump foundation layers. With this constitution, the remnants which are not removed by lift-off and left on the substrate surface and cause device defects are further removed by the adhesive tape, so that solder bumps which are highly reliable for flip chip bonding can be formed. |
