| 摘要 |
PROBLEM TO BE SOLVED: To detect the end point of a polishing process accurately so as to efficiently flatten the surface of a film layer, by a method wherein the surface data of the film layer is obtained by a detecting means provided to a polishing means, and it is judged based on signals outputted from the detecting means whether a polishing process is continued or discontinued by a control means. SOLUTION: A sensor 2 is held inside a partial polishing tool 4 as fixed. The sensor 2 is provided to the partial polishing tool 4 as hermetically isolated from the outside, whereby slurry, dust or the like is prevented from adhering to the sensor 2. The surface shape and thickness distribution of a work 101 are detected by the sensor 2 together with a control means 103. That a work polishing process is continued or discontinued is controlled by the control means 103 based on the detection result of the surface data of the work 101. The work 101 is composed of a silicon substrate 6 and an insulating film layer 5 formed on it and held by a substrate holder 7. |
