首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Epoxy resin composition for semiconductor sealing
摘要
申请公布号
SG43788(A1)
申请公布日期
1997.11.14
申请号
SG19960000866
申请日期
1989.12.08
申请人
SUMITOMO BAKELITE COMPANY, LIMITED
发明人
YANAGISAWA KENICHI;MOGI NAOKI;OHSUGA HIRONORI;SHIMAWAKI HIROSHI
分类号
C08G59/08;C08G59/32;C08L63/00;(IPC1-7):C08G59/32;H01B3/40
主分类号
C08G59/08
代理机构
代理人
主权项
地址
您可能感兴趣的专利
LUMINANCE AUTO CONTROL METHOD FOR DISPLAY MODULE
COB TYPE LED PACKAGE AND INSTALL METHOD
A DETECTOR FOR BIT POSITION
SYSTEM FOR EXTRACTING HEAT FROM AN EFFLUENT FLOWING IN A DUCT, AND HEAT EXCHANGER FOR SUCH A SYSTEM
METHOD OF PRODUCING SUBSTITUTED PYRIMIDIN-5-YL CARBOXYLIC ACIDS
NOWCASTING OF ONSET OF GEOEFFECTIVE PROTON FLUX IN NEAR-EARTH ENVIRONMENT
METHOD OF PRODUCING CARBON CATALYST SUPPORT
SELECTIVE AMPLIFIER
INTERFERENTIAL MONOCHROMATOR
DIELECTRIC CONICAL RADIATOR
SKIN COVERING STRUCTURE OF SEAT BACK
COLUMN CONSTRUCTION METHOD
LIGHTING CONTROL DEVICE
AC-DC CONVERTER
CARBONIC ACID FEELING APPLYING AGENT
DISTRIBUTED BACKUP AND RESTORATION SYSTEM
METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
REFRIGERATING DEVICE
BASE STATION DEVICE, TERMINAL DEVICE, AND METHOD
IMAGE FORMING SYSTEM, INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND COMPUTER PROGRAM
