| 摘要 |
A process is disclosed for producing a multilayered composite structure (1) with at least two conductive structures (2, 4) separated by an insulating layer (8). A continuous insulating layer is first introduced between the conductive structures. The insulating layer is then removed from the area of the contact points (5), for example by pressing the contact points under pressure and/or heat through the insulating layer onto the second circuit plane. This process is particularly simple and cost-effective, since it dispenses with the production of insulating foils having recesses which match the position of the contact points in a conductive structure, as well as with the accurate fitting of such an insulating foil or insulating layer on one of the conductive structures. |
