| 摘要 |
Method for depositing copper or copper alloy on a second metal substrate, made of aluminum or containing aluminum alloys, comprising the steps of : preparing a solution containing a source of copper Cu(II) ions, a complexing agent for said Cu(II) ions and an additive to adjust the pH of the solution to a required value; immersing said metal substrate in said solution for a predetermined period whereby growing a copper layer on said second metal substrate. <IMAGE> |
