A lid assembly for shielding electronic components from EMI/RFI interferences

摘要

A cover or lid assembly (10) is provided for EMI/RFI shielding. The cover or lid (11) is used in combination with an electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, a conductive frame (20), disposed about the electronic component. The conductive frame is electrically connected to the ground. An electrically conductive adhesive (12) is disposed continuously between the frame and the lid to mount the lid to the conductive frame to shield the electronic component from electromagnetic and radio frequency interference. <IMAGE>