| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the strength and thermal conductivity of a metallic substrate for a plastic package formed by sealing the semiconductor chips, bonded to a metallic substrate, with thermosetting resin. SOLUTION: The copper alloy has a composition consisting of 0.05-1.0% Cr, 0.03-0.8% Zr, and the balance Cu with inevitable impurities and containing, if necessary, (a) 0.01-1.0%, in total, of Ti, Ni, Sn, Fe, In, Mn, P, Mg and/or Si and (b) 0.01-2.0% Zn and/or containing (c) 0.05-1.8% Fe and (d) 0.05-0.8% Ti.</p> |
