| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer carrier wherein arrangement of wafers can be omitted at each manufacturing apparatus to reduce manufacturing processing time by adding a wafer arranging mechanism to the wafer carrier. SOLUTION: Wafers 14 are pushed toward a reference member by a pressing roller 9 attached to a roller attaching shaft 10 and held in a state arranged on a shelf 3 in a wafer carrier. When the wafer carrier is moved to a predetermined place, the roller attaching shaft can fall due to its own weight, whereby the roller attaching shaft is rotated by a ball nut 6, and the pressing roller rotates from a state in which the press the wafers to a position distant from the wafers. The wafer in the wafer carrier are received in an arranged state by being pushing by the pressing roller with proper force and pressing is canceled at a predetermined place, so that the wafers need not be arranged in each manufacturing device, thereby reducing manufacturing processing time.</p> |
