| 摘要 |
PROBLEM TO BE SOLVED: To prevent the defects at the assembling step of integrating lead terminals with a heat radiating plate. SOLUTION: A semiconductor device comprises a semiconductor chip 20, a heat radiating plate 10 having an island region 11 for mounting the semiconductor chip 20 and bosses 33, holes for inserting the bosses 33 and lead terminals 30. The holes and lead terminals 30 are disposed on the same plane and the island region 11 of the plate 10 is formed in a recess of the plate 10, lower than the end of the plate 10. |
