发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.
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申请公布号 |
US5686353(A) |
申请公布日期 |
1997.11.11 |
申请号 |
US19950576160 |
申请日期 |
1995.12.21 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YAGI, YOSHIHIKO;HIGASHI, KAZUSHI;TSUKAHARA, NORIHITO;KUMAGAI, KOICHI;YONEZAWA, TAKAHIRO |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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