| 摘要 |
A package mold die casting of a semiconductor device is disclosed. The package mold die casting of a semiconductor device has a lead frame(10) which is combined to a separate surface between a up shape(2) and a down shape(3) of a mold die casting and a air exhausting crevasse(8) is formed on a contact surface(6) of the up and down shapes(2,3), so that the air exhausting characteristic is significantly improved when molding the package with remaining the cavity(5). Thereby, the package molding keeps in a constant state, resulting in improving significantly the quality of the semiconductor device and preventing the void of the package and damage and improving a reliability of the semiconductor device.
|
