| 摘要 |
Computer apparatus 10 has a convective air flow therethrough for removing heat generated by the IC chips on circuit boards 12H, 12M, and 12L and by other computer components within housing 10H. The housing confines the convective air flow, and has elongated I/O openings 10E therethrough for accommodating I/O connections to the circuit boards. The circuit boards are mounted within the housing in an adjacent parallel relationship forming air flow channels therebetween. Each circuit board has a housing end 12P proximate the I/O openings in the housing and an interior end 12D distant from the housing. A mounting bracket 14 is fastened to each circuit board at the housing end and is secured to the housing to cover the I/O openings. Air vent apertures 16 in the mounting brackets provide air flow communication through the mounting brackets and the I/O openings for directing a portion of the convective air flow through the channel over the adjacent circuit boards. Fan 10F pushes the air flow out of the housing causing cool outside air to be drawn into the housing through each aperture 16.
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