发明名称 |
Manufacturing circuit boards dipped in molten solder |
摘要 |
Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit structure. This is achieved by supporting the structure on a carrier 9 which in turn is attached to a motor shaft 11.
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申请公布号 |
US5683743(A) |
申请公布日期 |
1997.11.04 |
申请号 |
US19950497615 |
申请日期 |
1995.06.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BANKS, PETER MICHAEL;MORGAN, WILLIAM M. |
分类号 |
B23K1/06;B23K1/08;B23K3/06;B23K101/42;H05K1/00;H05K3/28;H05K3/34;(IPC1-7):B05D1/18;B05D5/12 |
主分类号 |
B23K1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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