发明名称 Manufacturing circuit boards dipped in molten solder
摘要 Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit structure. This is achieved by supporting the structure on a carrier 9 which in turn is attached to a motor shaft 11.
申请公布号 US5683743(A) 申请公布日期 1997.11.04
申请号 US19950497615 申请日期 1995.06.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BANKS, PETER MICHAEL;MORGAN, WILLIAM M.
分类号 B23K1/06;B23K1/08;B23K3/06;B23K101/42;H05K1/00;H05K3/28;H05K3/34;(IPC1-7):B05D1/18;B05D5/12 主分类号 B23K1/06
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