发明名称 |
Ceramic oxide circuit board |
摘要 |
Internal wiring made of copper of low-resistance is provided in a ceramic oxide. Green sheets 10 made of oxide powder are provided with plane wiring 18 and/or via wiring 14 in which copper is used as wiring material. The green sheets 10 are laminated and integrated in such a manner that the wiring portions 4 and 18 are covered with the green sheet so as not to be exposed onto a surface. Then the laminated body is fired at a maximum temperature in a range from 1,083 DEG to 1,800 DEG C.
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申请公布号 |
US5683791(A) |
申请公布日期 |
1997.11.04 |
申请号 |
US19960689692 |
申请日期 |
1996.08.13 |
申请人 |
SHINKO ELECTRIC INDUSTRIES, CO., LTD. |
发明人 |
HORIUCHI, MICHIO;HARAYAMA, YOICHI |
分类号 |
H05K1/03;B32B37/18;H01L21/48;H05K1/09;H05K3/12;H05K3/24;H05K3/26;H05K3/40;H05K3/46;(IPC1-7):B32B3/00;B32B15/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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