发明名称 SUBSTRATE CONVEYER AND SUBSTRATE CONVEYING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a small-sized high-throughput conveyer for conveying semiconductor wafers, having a mechanism capable of carrying two semiconductor wafers at once over an immovable point position, without causing a jack knife phenomenon. SOLUTION: A pair of first arms 6a, 6b are coupled laterally symmetrically with two coaxially disposed driving shafts 3a, 3 capable of driving independently each other. A first pulley 9 is fixed to the shaft 3a of the first one arm 6a. A pair of second arms 8a, 8b are laterally symmetrically with the ends of the first arms 6a, 6b through rotatable bearings. A second pulley 10 is provided coaxially to the rotary shaft of the second arm 8b coupled with the first arm 6b and coupled with the first pulley 9 through a rotary power transmission medium e.g. belt 11.
申请公布号 JPH09283588(A) 申请公布日期 1997.10.31
申请号 JP19960084941 申请日期 1996.04.08
申请人 HITACHI LTD 发明人 KASHIMA HIDEO;KAWAMURA YOSHIO;KANETOMO MASABUMI;MATSUMURA YASUHIDE;KURODA KATSUHIRO
分类号 B65G49/07;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/07
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