| 摘要 |
PROBLEM TO BE SOLVED: To relax thermal stress generated in a heat dissipation member and improve cooling efficiency by providing a corrugated heat dissipation member between a semiconductor chip of a module wherein a substrate whereon a semiconductor chip is mounted by flip chip mounting is laminated and an adjacent substrate. SOLUTION: Mounting substrates 2a to 2d whereon a semiconductor chip 1 is mounted are stacked in four layers by using a substrate connecting bump 6. Copper corrugated heat dissipation members 5a to 5c are installed between the semiconductor chips 1 of the mounting substrates 2b to 2d and a rear of the mounting substrates 2a to 2c to come into contact thermally by its elasticity. That is, the corrugated heat dissipation members 5a to 5c are used and are brought into contact with a heat generation part instead of adhering a plane heat sink. Since the heat dissipation members 5a to 5c have a large heat dissipation area, cooling effect is large. Furthermore, since the heat dissipation members 5a to 5c are not adhered anywhere, thermal stress is not generated. Therefore, heat cycle life can be made long. |
