发明名称 |
LIGHT DETECTING AND EMITTING ELEMENT MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a light detecting and emitting element module which enables the high-density mounting of chips and allows defective chips to be easily replaced. SOLUTION: A LED module 10 has LED chips 13 arranged in an array with mutual spacings on the surface of a semiconductor substrate 11, each chip having a plurality of light emitting diodes LED 15. The chips 13 include alternately arranged high chips 13a and low chips 13b thinner than the high chips 13a. The high chip 13a has slant faces 17 adjacent to and overhanging the low chips 13b in profile of the chip array. |
申请公布号 |
JPH09283807(A) |
申请公布日期 |
1997.10.31 |
申请号 |
JP19960096741 |
申请日期 |
1996.04.18 |
申请人 |
OKI ELECTRIC IND CO LTD |
发明人 |
YANAKA MASUMI;OGIWARA MITSUHIKO;SHIMIZU TAKAATSU |
分类号 |
B41J2/44;B41J2/45;B41J2/455;H01L31/02;H01L33/62;H04N1/028;H04N1/19 |
主分类号 |
B41J2/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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