| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and manufacturing method thereof, which realizes a fine-pitched ball grid array, small-sized package, and improvement of the connection reliability. SOLUTION: This semiconductor device has semiconductor elements 14 and is mounted in an external circuit. Recesses 5 for forming solder bumps of a ball grid array is formed on one side of a metal plate 1. A solder layer and conductor metal layer are formed on the recesses by the electroless plating. Required number of insulation layers 8, 11 and interconnection layers 9, 12 are repetitively formed on the metal plate to form a multilayer interconnection circuit board. The semiconductor elements 14 are mounted thereon and sealed with resin. The metal plate is etched off to form solder bumps 17. |
