| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a bonding agent layer only on the parts where inner leads are fixed on a semiconductor element by a method wherein a bonding agent resin is printed on the bonding agent layer, with which the leads are fixed on the element, using a metal mask to form the bonding agent layer only on the parts where inner leads are fixed on the element. SOLUTION: Inner leads 2 are bonded and fixed on a semiconductor element 1 with a bonding agent layer 3. A bonding agent resin is printed, applied and dried on the surface sides of the leads 2 which are bonded on the element 1, using a metal mask and the bonding agent layer is formed only on the parts of the leads 2 which are required for fixing on the element 1. The surface of a circuit of the element 1 is thermally pressure bonded to a lead frame with a bonding agent obtained in such a way using a normal chip mounter. After that, electrodes on the surface of the element 1 and the inner leads are electrically connected with each other by wire-bonding to seal the whole semiconductor device with a resin.</p> |
