CLEANING METHOD AND CLEANING DEVICE OF POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To eliminate blinding of a porous vacuum chuck and maintain suction force of a porous vacuum chuck uniform. SOLUTION: When a polisher for a wafer by sucking it to a porous vacuum chuck 22 is cleaned, at least the porous vacuum chuck 22 is immersed in cleaning liquid L and cleaned by applying ultrasonic vibration 52. Cleaning is carried out while making fluid flow to the porous vacuum chuck 22 from an evacuation through hole 26. It is desirable to apply the ultrasonic vibration 52 while vertically reciprocating a porous vacuum chuck by at least a stroke equal to or larger than the thickness of the porous vacuum chuck 22 relatively to cleaning liquid.