发明名称 DYNAMIC ANALYZING APPARATUS OF ELECTRODEPOSITION PROCESS
摘要 <p>PROBLEM TO BE SOLVED: To provide an apparatus capable of dynamically measuring the structure change of the deposit electrodeposited on an electrode surface from the initial stage of formation by using X-rays while passing an electrolyte. SOLUTION: This apparatus continuously analyzes the electrodeposition reaction at the time of applying plating on a metal by irradiation with X-ray beams 8, 9. A carbon plate window 7 through which the incident X-rays from above and the reflected exit X-rays thereof are arranged in the upper part of the apparatus body. An electrode 1 which executes electrodeposition is disposed via a spacing for supplying the electrolytic plating liquid of 0.05 to 0.5mm under this carbon plate window 7. A vertical fine adjustment device 2 capable of finely adjusting the vertical movement of the electrode is fixed to the lower part of the electrode 1.</p>
申请公布号 JPH09279400(A) 申请公布日期 1997.10.28
申请号 JP19960088099 申请日期 1996.04.10
申请人 NIPPON STEEL CORP 发明人 KUROSAKI MASAO;KAWASAKI KOICHI;KIKUCHI TOSHIJI
分类号 G01N23/20;C25D21/12;(IPC1-7):C25D21/12 主分类号 G01N23/20
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