发明名称 |
DYNAMIC ANALYZING APPARATUS OF ELECTRODEPOSITION PROCESS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus capable of dynamically measuring the structure change of the deposit electrodeposited on an electrode surface from the initial stage of formation by using X-rays while passing an electrolyte. SOLUTION: This apparatus continuously analyzes the electrodeposition reaction at the time of applying plating on a metal by irradiation with X-ray beams 8, 9. A carbon plate window 7 through which the incident X-rays from above and the reflected exit X-rays thereof are arranged in the upper part of the apparatus body. An electrode 1 which executes electrodeposition is disposed via a spacing for supplying the electrolytic plating liquid of 0.05 to 0.5mm under this carbon plate window 7. A vertical fine adjustment device 2 capable of finely adjusting the vertical movement of the electrode is fixed to the lower part of the electrode 1.</p> |
申请公布号 |
JPH09279400(A) |
申请公布日期 |
1997.10.28 |
申请号 |
JP19960088099 |
申请日期 |
1996.04.10 |
申请人 |
NIPPON STEEL CORP |
发明人 |
KUROSAKI MASAO;KAWASAKI KOICHI;KIKUCHI TOSHIJI |
分类号 |
G01N23/20;C25D21/12;(IPC1-7):C25D21/12 |
主分类号 |
G01N23/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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