发明名称 Method of fabricating a toothed-shape capacitor node using a thin oxide as a mask
摘要 The present invention is a method of fabricating a toothed-shape capacitor node in semiconductor DRAM circuit. This invention utilizes dot silicon formed on a nitride layer as an etching mask. The nitride uncovered by the dot silicon is removed. A first layer of poly-oxide is formed using thermal oxidation. The first poly-oxide layer is removed and a second poly-oxide layer is formed using thermal oxidation. The remaining nitride is removed uncovering the polysilicon. The polysilicon is etched to form trenches in the bottom storage of the capacitor. Finally, the second poly-oxide is removed. Thus, a toothed-shape capacitor node is formed in semiconductor circuit.
申请公布号 US5681774(A) 申请公布日期 1997.10.28
申请号 US19970791518 申请日期 1997.01.30
申请人 VANGUARD INTERNATIONAL SEMICONDUCTOR CORP. 发明人 TSENG, HORNG-HUEI
分类号 H01L21/02;H01L21/8242;H01L27/108;(IPC1-7):H01L21/70 主分类号 H01L21/02
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