发明名称 SILICON CARBIDE CMOS AND METHOD OF FABRICATION
摘要 A monolithic CMOS integrated device formed in silicon carbide and method of fabricating same. The CMOS integrated device includes a layer of silicon carbide of a first conductivity type with a well region of a second conductivity type formed in the layer of silicon carbide. A MOS field effect transistor is formed in the well region and a complementary MOS field effect transistor is formed in the silicon carbide layer. The method of fabrication of CMOS silicon carbide includes formation of an opposite conductivity well region in a silicon carbide layer by ion implantation. Source and drain contacts are also formed by selective ion implantation in the silicon carbide layer and the well region. A gate dielectric layer is formed by deposition and re-oxidation. A gate electrode is formed on the gate dielectric such that a channel region is formed between the source and the drain when a bias is applied to the gate electrode. Source drain and body contacts are preferably formed of the same material in a single fabrication step.
申请公布号 WO9739485(A1) 申请公布日期 1997.10.23
申请号 WO1997US06156 申请日期 1997.04.14
申请人 CREE RESEARCH, INC.;SLATER, DAVID, B., JR.;LIPKIN, LORI, A.;SUVOROV, ALEXANDER, A.;PALMOUR, JOHN, W. 发明人 SLATER, DAVID, B., JR.;LIPKIN, LORI, A.;SUVOROV, ALEXANDER, A.;PALMOUR, JOHN, W.
分类号 H01L29/16;H01L21/04;H01L21/82;H01L21/8238;H01L23/31;H01L27/06;H01L27/092;H01L29/24;H01L29/51;H01L29/78 主分类号 H01L29/16
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