| 摘要 |
<p>PROBLEM TO BE SOLVED: To simplify the constitution of an electrode and a wiring part and to increase reliability of a connection part by forming an insulation layer into such a structure that opening parts are equipped in only both the opposite part of the respective element electrodes and the connection part of a one-side element electrode connected to the upper wiring. SOLUTION: In an electron emission substrate, the lower wiring and the upper wiring consist of a thick-film electrode through a flat interlaminar insulation layer and are arranged in a matrix shape through the insulation layer 6. A surface conduction type electron discharge element having a couple of element electrodes 2, 3 is arranged in the crossing part of the upper and lower wirings. The insulation layer 6 is formed into such a structure that opening parts are provided in only both the opposite part of the respective element electrodes and the connection part of a one-side element electrode connected to the upper wiring. In other words, an opening part 7 is provided in the connection part of the insulation layer 6 formed into a flat shape and the element electrode 3. An opening part 8 is provided in the position in which the opposite part of the element electrodes 2, 3 formed with a thin film 4 thereon is exposed. Generation rate of a short circuit defect caused by dislocation of a printed circuit and a shape defective is reduced and drastic cost reduction is achieved.</p> |
