| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor package, by installing outer connection terminals on a metal conductor layer at least a part of which is exposed on one surface of an insulating resin molded object. SOLUTION: At least one or more semiconductor IC chip 9 and metal conductor layers 8 connected with the chip 9 by wire bonding are molded, and an insulating resin layer molded object 12 is formed. Outer connection terminals 14 are formed on the metal conductor layers 8 wherein at least a part of one surface of the insulating resin molded object 12 is exposed. A semiconductor package obtained in the above manner is directly constituted at an arbitrary position of the insulating resin molded object 12 wherein the outer connection terminals 14 molds the semiconductor IC chip 9, so that the package can be miniaturized and thinned. By using a semiconductor package wherein protruding metal conductors 8 are formed on the outer connection terminals 14, reliability of solder connection with a printed wiring board can be improved. |
