发明名称 Pin-fin heat sink
摘要 <p>The sink, mounted on an outer surface of the package includes pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration. The pins are in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarised to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing elongated rods by retainers placed at intervals corresponding to a height of the heat sink before cutting off the rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration.</p>
申请公布号 EP0632498(B1) 申请公布日期 1997.10.15
申请号 EP19940304526 申请日期 1994.06.22
申请人 AT&T CORP. 发明人 BRADY, KEVIN JAMES;COHN, CHARLES
分类号 H01L23/36;H01L23/367;(IPC1-7):H01L23/367;H01L21/48 主分类号 H01L23/36
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