High-frequency piezoelectric power actuator apparatus with heat dissipation

摘要

The apparatus includes a stack of elementary polarised rings (1) of sintered lead zirconate-titanate ceramic with contact material (3) between them. The rings are bonded by thermally hardened epoxy resin to plates (2) of copper-bronze alloy 100 mu m thick with smaller central holes. Alternate plates are interconnected by copper wires (7) with dip-soldered joints (6). The portion of each plate protruding from the stack is in the form of a 270 deg segment of a circle with the same external diameter (D2), extending tangentially into a rounded 90 deg vertex. With an applied voltage of 1 kV such a device has an expansion of 21 mu m and capacitance of 111 nF.