| 摘要 |
<p>PURPOSE: To provide a suction plate for a vacuum chuck which can prevent a porous body played with dust in operation. CONSTITUTION: A suction plate 3 for a vacuum chuck 2 is provided with a suction surface S for a wafer W. A fitting hole 7 is provided at the central part of the surface S as a first suction recessed section and a flat porous body 9 is fitted in the opening 7a of the hole 7. In addition, a suction groove 10 is provided around the porous body 9 so as to surround the body 9 as a second suction recessed section. Both the porous body 9 and groove 10 are communicated with a vacuum pump provided for an evacuating means.</p> |
