Method and apparatus for designing a module

摘要

A method for designing a multilayer module for a semiconductor package and for determining connections within a multilayer module having input-output (IO) contacts in a first array defined by first array information. A chip within the module has C4 contacts arranged in a second array defined by second array information. The connections are intermediate pairs of the IO contacts and the C4 contacts among a plurality of layers. The method comprises the steps of storing the first and second array information in storage; identifying connection paths in a layer between the pairs according to a selection algorithm using the first and second array information; identifying crossing paths; swapping either the C4 or IO contacts of selected crossing paths; identifying paths being blocked by another connection path to identify a need for a next layer to complete the blocked connection paths; repeating the method for subsequent layers for a predetermined number of iterations or until all connection paths are defined.