| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of malconnection in through hole connections between the wirings of a first group of wirings and those of a second group of wirings. SOLUTION: A first group of wirings consisting of a plurality of wirings 2 are attached onto a substrate 1. Next, a thin plate glass 3 having a plurality of through holes 3a is put on the board 1 and fixed so that the through holes 3a may be arranged above each wiring 2 of the above-mentioned first group of wirings. And a second group of wirings consisting of a plurality of wirings 5 are attached onto the thin plate glass 3 so that each wiring 5 of the second group of wirings may be connected to each wiring 2 of the above-mentioned first group of wirings electrically through the through holes 3a of the thin plate glass 3. |
