发明名称 Method of manufacture DRAM capacitor with reduced layout area
摘要 A method of manufacturing a capacitor for use in a DRAM. The method includes forming an isolation layer over a substrate, forming a nitride layer over the isolation layer, forming a hole in the isolation and nitride layers, forming a polysilicon plug in the hole, growing an oxide plug from an upper portion of the polysilicon plug, removing the nitride layer, forming a polysilicon spacer around the oxide plug, and removing the silicon dioxide plug. Additional steps include depositing a dielectric layer onto the polysilicon sidewall and plug, and depositing a third polysilicon layer onto the dielectric layer.
申请公布号 US5677221(A) 申请公布日期 1997.10.14
申请号 US19960666801 申请日期 1996.06.19
申请人 VANGUARD INTERNATIONAL SEMICONDUCTOR CORP. 发明人 TSENG, HORNG-HUEI
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01L21/70 主分类号 H01L21/02
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