| 摘要 |
<p>A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises: a valve assembly defining a valve chamber (15) with an inlet (17) and an outlet (19), and having the valve member (35) actuated by the pin (30) of said pin-in-through-hole joining zone when the valve is positioned at the zone against the board (22), the valve member (35) moving from a first position closing off fluid flow from the outlet to a second position permitting fluid flow through the outlet (19); means (41) for measuring a predetermined body of fluid solder (14) that is released from the chamber (15) when said valve member (35) is in the second position with the assembly positioned at the zone against the board (22); and means (43) to contain the released fluid solder (14) in a predetermined shape and in and around the pin-in-through-hole joining zone while the solder solidifies.</p> |
