CONDUCTIVE CHIP CERAMIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a ceramic device which exhibits high solder heat resistance and high soldered joint strength, whose resistance is not changed by electrode plating, and which can be manufactured relatively easily and at a low cost and is suitable for mass production. SOLUTION: A conductive chip ceramic element 10 is provided with two terminal electrodes 12 on the surface of its ends and an insulating layer 14 of inorganic substance covering its surface. The terminal electrodes 12 are comprised of a baking electrode layer 16 and plating layers 18 and 19. The inorganic layer 14 has a melting point or a softening point higher than the baking temperature of the electrode layer 16. The electrode layer 16 is formed by baking a conductive paste containing metal powder and inorganic binder. The inorganic layer is 2-5μm thick. The composition of the inorganic layer 14 and that of the inorganic binder are limited so that the melting point or the softening point of both when they are reacted with each other may be lower than the baking temperature of the baking electrode layer 16. The inorganic layer coated under the conductive paste is reacted with the inorganic binder during the formation the baking electrode layer 16, molten, absorbed and destroyed.