RESIST MATERIAL AND PRODUCTION OF THIN FILM MULTILAYERED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To form a resist pattern excellent in heat resistance and cross-sectional shape by incorporating epoxy modified cycloolefin resin and a crosslinking agent capable of photocrosslinking the resin. SOLUTION: Epoxy modified cycloolefin resin and a crosslinking agent capable of photocrosslinking the resin are incorporated. The epoxy modified cycloolefin resin is preferably epoxy modified thermoplastic norbornane resin obtd. by introducing epoxy groups into thermoplastic norbornane resin. The pref. rate of epoxy modification of the cycloolefin resin is 0.05-2wt.%, especially 0.008-1wt.% (expressed in terms of the wt.% of the oxygen of epoxy groups based on the weight of the resin).